Publications

Dissemination

 

09/2022: Engineered SiC materials for power technologies

• Author(s): W. Schwarzenbach, S. Rouchier, G. Berre, R. Boulet, O. Ledoux, E. Cela, A. Drouin, A. Chapelle, S. Monnoye, H. Biard, K. Alassaad, L. Viravaux, N. Ben Mohamed, D. Radisson, G. Picun, G. Lavaitte, A. Bouville-Lallart, J. Roi, J. Widiez, K. Abadie, E. Rolland, F. Fournel, G. Gélineau, F. Mazen, A. Moulin, C. Moulin, D. Delprat, N. Daval, S. Odoul, P. Sandri and C. Maleville
• Partner: Soitec, CEA
• Published: International Conference on IC Design and Technology 2022 (ICICDT22)
• https://ieeexplore.ieee.org/document/9933092

 

09/2022: Evaluation of crystal quality and dopant activation of Smart Cut™-transferred 4H-SiC thin film

• Author(s): G. Gelineau, J. Widiez, E.Rolland, K.Vladimirova, A. Moulin, V. Prudkovskiy, N.Troutot, P. Gergaud, D. Mariolle,
  S. Barbet, V. Amalbert, G. Lapertot, K. Mony, S. Rouchier, R. Boulet, G. Berre, W. Schwarzenbach, Y. Bogumilowicz
• Partner: CEA, Soitec
• Published: 19th International Conference on Silicon Carbide and Related Materials (ICSCRM2022)
• https://doi.org/10.4028/p-026sj4

 

09/2022: Evaluation of crystal quality and dopant activation of Smart Cut™-transferred 4H-SiC thin film

• Author(s): G. Gelineau, J. Widiez, E.Rolland, K.Vladimirova, A. Moulin, V. Prudkovskiy, N.Troutot, P. Gergaud, D. Mariolle,
  S. Barbet, V. Amalbert, G. Lapertot, K. Mony, S. Rouchier, R. Boulet, G. Berre, W. Schwarzenbach, Y. Bogumilowicz
• Partner: CEA, Soitec
• Published: scientific poster at 19th International Conference on Silicon Carbide and Related Materials (ICSCRM2022)
• TRANSFORM_Poster ICSCRM2022_CEA_Soitec.pdf

 

09/2022: Impact of aluminum casing on high-frequency transformer leakage inductance and AC resistance

• Author(s): Reda Bakri, Wendell Da Cunha Alves, Xavier Cimetiere, Frédéric Gillon, Antoine Bruyere, Lucian Vatamanu
• Partner: Université de Lille, L2EP, Valeo Siemens eAutomotive France
• Published: 24th European Conference on Power Electronics and Applications (EPE'22 ECCE Europe)
• https://ieeexplore.ieee.org/document/9907445

 

05/2022 New Die Attach Materials: Silver and Silver/ Copper sintering pastes

• Author(s): B. Rábay, A. Stelzer
• Partner: Nanoj
• Published: PCIM Europe Conference 2022
• https://www.vde-verlag.de/proceedings-de/565822280.html

 

04/2022: The Mobility Scenario vs Green Deal Objectives

• Author(s): Antonio Imbruglia, Francesco Gennaro, Pietro Di Grazia
• Partner: STMicroelectronics, Italy
• Published: Smart System Integration 2022 (26-28.04.2022 in Grenoble)
• TRANSFORM_Paper SSI2022_ST-IT.pdf

 

03/2022 SmartSiC TM for Manufacturing of SiC Power devices

• Author(s): Nicolas Daval et al.
• Partner: Soitec, CEA
• Published: 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
• https://ieeexplore.ieee.org/document/9798032

 

03/2022: Supporting Collaborative Innovation Processes in Smart Product Value Creation Networks

• Author(s): Damun Mollahassani, Jonas Gries, Sven Forte, Jens C. Göbel
• Partner: TU Kaiserslautern
• Published: 32nd CIRP Design Conference
• https://doi.org/10.1016/j.procir.2022.05.261

 

03/2022: Optimization-Based Capacitor Balancing Method with Customizable Switching Reduction for CHB Converters

• Author(s): Luis Galván, Pablo Jesús Gómez, Eduardo Galván, Juan Manuel Carrasco
• Partner: University of Seville (USE)
• Published: Energies 2022, 15(6), 1976
• https://www.mdpi.com/1996-1073/15/6/1976

 

12/2021: Optimization-Based Capacitor Balancing Method with Selective DC Current Ripple Reduction for CHB Converters

• Author(s): Luis Galván, Pablo Jesús Gómez, Eduardo Galván, Juan Manuel Carrasco
• Partner: University of Seville (USE)
• Published: Energies 2022 15(1), 243
• https://www.mdpi.com/1996-1073/15/1/243

 

10/2021: 150mm SiC engineered substrates for high-voltage power devices

• Author(s): Séverin Rouchier et al.
• Partner: Soitec, CEA
• Published: Trans Tech Publications Ltd, Switzerland for ECSCRM 2021
• https://doi.org/10.4028/p-mxxdef