TRANSFORM Value Chain
- Develop transformative substrate technology from TRL3 to pilot line
- Develop production type equipment for SiC technology
- Qualify the new substrate technology at device and system level, preparing for industrial ramp-up
- Develop planarMOS and trenchMOS technologies with strongly enhanced performance, capable to use the new substrate technology
- Develop assembly and interconnect technologies for SiC, optimizing performance, reliability, cost by physical investigation and digital twins.
- Optimize design and architecture for SiC based power electronic systems to increase energy efficiency and reduce the total cost of ownership (TCO) for most relevant application domains
- Prove pervasive applicability of European silicon carbide technology in demonstrators for a different application domains.